Full Site - : gold thickness wire bond (Page 5 of 27)

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Industry News | 2012-09-04 08:51:32.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.

Hesse Mechatronics

Re-Source Direct, Inc. (Asian Supply Chain Management Team)

Industry Directory | Manufacturer

We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each

CAD Design Software

Industry Directory | Consultant / Service Provider

CAD Design Software products run in the AutoCAD environment.

AuSn Solder Electroplating

AuSn Solder Electroplating

New Equipment | Solder Materials

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl

Micralyne Inc.

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

Heraeus Electronics to introduce new advanced solutions to further elevate device performance at SEMICON China 2023

Industry News | 2023-07-03 19:52:11.0

Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.

Heraeus

Würth Elektronik Expands its Service Portfolio

Industry News | 2013-06-03 11:00:12.0

The smaller the circuit board, the less space there is to connect the individual components. Wire bonding provides a very reliable alternative to soldered connections, and it is with this approved method that Würth Elektronik is expanding its service portfolio and taking a further step towards becoming a global circuit board systems company.

Würth Elektronik GmbH & Co. KG

Viscom implements groundbreaking 3D technology across its entire product range

Industry News | 2018-11-14 15:34:52.0

Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.

Viscom AG

Henkel Electronics Assembly Film Adhesives

Henkel Electronics Assembly Film Adhesives

New Equipment | Materials

The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli

Henkel Electronic Materials


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