Full Site - : gold thickness wire bond (Page 10 of 27)

AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156

Industry News | 2014-06-05 12:21:18.0

AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.

AI Technology, Inc. (AIT)

Heraeus Electronics showcases new portfolio for next-generation power electronics and semiconductor advanced packaging at SEMICON Korea 2023

Industry News | 2023-01-30 16:56:37.0

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus

Dr. David Bernard of Nordson DAGE to Present X-ray Inspection Technology Paper at SMTA International 2011

Industry News | 2011-09-26 16:59:34.0

Nordson DAGE announces that Dr. David Bernard, Product Manager – X-ray Systems, will present a paper titled “The Implications of Recent Technology Advances for X-Ray Inspection in Electronics” at the upcoming SMTA International Conference & Exhibition.

Nordson DAGE

Nordson to exhibit many new solutions for electronics manufacturing at Productronica 2017

Industry News | 2017-11-07 17:14:32.0

Nordson Corporation (NASDAQ: NDSN) announces that eight divisions from its Advanced Technology segment will be exhibiting together at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, stands 245, 345, and 445.

Nordson Corporation

One Minute to Understand AXI and Utilize It for Free

Industry News | 2019-08-15 07:31:59.0

AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.

Elecrow

Indium Corporation to Feature Innovative Products for Automotive and Power Electronics Applications at NEPCON Japan

Industry News | 2023-01-23 17:37:22.0

Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.

Indium Corporation

Don't Miss Pemtron Technology's 3D SPI, AOI, CCI and X-ray Component Counter at APEX

Industry News | 2022-12-14 12:08:09.0

Pemtron Technology, an inspection equipment developer and supplier, is gearing up for the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company plans to bring a full line up this year: Saturn 3D Inline Solder Paste Inspection System, Athena 3D Automated Optical Inspection System, TWIN 3D Automated Optical Inspection System, TROI 8800 CI Series Conformal Coating Inspection System and Mercury Automated X-ray SMD Counter. Be sure to visit Booth #2314 during the IPC APEX EXPO.

Pemtron

PEMTRON Sparks Innovation with World-Class Inspection Systems at SMTconnect 2024

Industry News | 2024-05-20 10:30:03.0

PEMTRON EUROPE is pleased to announce its participation in the upcoming SMTconnect, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. See the invisible world in Hall 4A, Stand 245 – Visitors can expect to see PEMTRON's latest advancements in inspection systems, including the Saturn 3D Inline Solder Paste Inspection System, Athena TPI Press-fit 3D Automated Optical Inspection System, TWIN Top/Bottom Double Sided Simultaneous 3D Automated Optical Inspection System, and TROI 8800 CI Series Conformal Coating Inspection System.

Pemtron

Resin plug application and process

Industry News | 2019-05-16 01:24:13.0

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.

Headpcb

New Viscom 3D AOI line-up and 360View feature for improved 3D inspection

Industry News | 2016-07-26 18:48:27.0

Viscom today announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature in Stand 1F35 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre.

Viscom AG


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