Industry News | 2002-04-01 07:50:34.0
Announces That it Has Successfully Completed Qualification Testing
Industry News | 2022-03-08 11:31:41.0
New Adam Tech Cable/Connector Assembly from Omni Pro Supports Speeds up to 48GBPS
Incorporating a cable lock option, the 62674 series of 0.5mm pitch vertical connectors from FCI provides a high cable retention force for flexible printed circuits. Preheld by the connector's compact slider mechanism, cables are easily mated in a ze
Industry News | 2015-04-07 15:34:16.0
Microtronic GmbH, a leading sales specialist of microelectronics, will display a range of products in Booth # 7-101L at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2021-07-26 17:33:25.0
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
Industry News | 2013-01-15 16:31:41.0
– AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo,
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
Industry News | 2020-12-21 09:11:22.0
Several Ranges of Miniature Filters with Different Low-pass Configurations were designed to Protect Electronic Equipment from Interferences
Industry News | 2024-01-29 11:36:51.0
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Industry News | 2012-01-20 15:08:03.0
AIM will debut its new NC259 Solder Paste chemistry in Booth #2804 at the upcoming IPC APEX Expo.
