Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2012-05-10 20:09:28.0
AIM, will highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Toronto Expo & Tech Forum,
Industry News | 2012-05-31 16:42:36.0
AIMwill highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.
Industry News | 2012-04-17 11:22:21.0
AIM will highlight its NC259 no-clean solder paste chemistry in Booth #1A02 at the upcoming NEPCON China 2012.
Industry News | 2012-07-25 10:17:38.0
AIM, will highlight its new NC259 Solder Paste
Industry News | 2012-09-13 14:02:26.0
AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,
Industry News | 2013-02-21 07:01:08.0
AIM Solder today announced that it has been awarded a 2013 NPI Award in the category of Flux for its NC277 No-Clean Liquid Flux.
Industry News | 2021-08-02 12:55:28.0
Additional assembly and production staffing has been added to provide increased support to our growing customer base.
Industry News | 2012-05-21 13:23:06.0
NC275LR is really leading-edge technology for VOC-free fluxes.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
