New SMT Equipment: gold-tin contnet analysis (1)

Indium Solder Wire

Indium Solder Wire

New Equipment | Solder Materials

Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. Indium Solder Wire Diameters We m

Indium Corporation

Electronics Forum: gold-tin contnet analysis (4)

Silver Sulphide Contamination of Resistors

Electronics Forum | Wed Feb 21 19:55:12 EST 2001 | davef

References on corrosion are: * "ASM Corrosion Handbook No. 13" [0871700077]. * "Electronic Packaging and Corrosion" ME Nicholson [0871702916]. Please explain how you determined that you have silver-sulfide contamination. Where is the silver comin

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

Express Newsletter: gold-tin contnet analysis (281)

Partner Websites: gold-tin contnet analysis (17)

Dissolution Rate of Specific Elements in SAC305 Solder

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255

. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys

Heller Industries Inc.


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