Full Site - : good joints (Page 14 of 169)

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Celestica Corporation

Nihon Superior to Highlight Advanced Soldering Materials at SMTAI 2010

Industry News | 2010-10-04 17:16:14.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it will highlight its SN100C P602 Solder Paste and NS-F900 Wave Soldering Flux in booth 226 at the upcoming SMTA International exhibition, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Nihon Superior Co., Ltd.

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive

Technical Library | 2018-07-11 22:46:13.0

For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.

Koki Company LTD

SN100c Lead-Free Bar Solder

SN100c Lead-Free Bar Solder

New Equipment | Solder Materials

FCT Assembly has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to th

FCT ASSEMBLY, INC.

S3088 basic - AOI System with High-End Compatible Inspection Capabilities

S3088 basic - AOI System with High-End Compatible Inspection Capabilities

New Equipment | Inspection

Full Viscom 2.5D defect detection coverage for placement and solder joint inspection. Extremely reliable, proven inspection for reflow, pre-reflow, wave and selective soldering Revolutionary simplicity in AOI operation with vVision Scalable came

Viscom AG

Wavesolder Process Engineer Wave Solder

Career Center | Danville, Illinois USA | Production

http://jobs-watchfiresigns.icims.com/watchfiresigns_jobs/jobs/candidate/job.jsp?jobid=1005&mode=view Overview: Watchfire Signs is a dynamic, exciting place to work. Our process engineers utilize their required Bachelors of Engineering and required

Watchfire Signs

SMT Supervisor

Career Center | Van Nuys, California USA | Production

We are an ISO 9000, AS 9100, ISO 13485 and NASA certified;  Quick Turn, High Reliability, Contract Manufacturer of PCB assemblies, located in the San Fernando Valley. We serve the aerospace, military, space, medical and telecommunications and other L

Electronic Source Company

SMART Group Launches Next FREE Guide in the Series: PCB Surface Finish Defect Guide

Industry News | 2017-04-04 15:22:45.0

SMART Group announces that the “Printed Circuit Solderable Finish Defect Guide” has been printed and is available free of charge.

The SMART Group

Lead-free Reflow Profile: Soaking type vs. Slumping type

Industry News | 2018-10-18 08:44:36.0

Lead-free Reflow Profile: Soaking type vs. Slumping type

Flason Electronic Co.,limited


good joints searches for Companies, Equipment, Machines, Suppliers & Information