The Wax Injection Machine is used to make wax patterns in the investment casting process with middle- temperature wax technology. It features with a multiple improvements of saving energy, high efficiency and good adaptability. Features Advanced
Industry News | 2008-05-22 12:03:46.0
New Lead Free Solder Wire Improves Quality & Reduces Solder Tip Consumption
Industry News | 2010-10-27 18:45:14.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has been awarded a Global Technology Award in the category of Flux for its NS-F900 Halogen-free Flux for Wave Soldering.
Industry News | 2011-04-20 17:56:08.0
Nihon Superior Co. Ltd. announces that it has been awarded a 2011 NPI Award in the category of Flux for its NS-F900 Halogen-free Flux for Wave Soldering. The award was presented to the company during a Tuesday, April 12, 2011 ceremony that took place at the Mandalay Bay Resort & Convention Center in Las Vegas during IPC APEX 2011.
Industry News | 2009-03-01 22:13:07.0
OSAKA, JAPAN � February 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces Extra Fine Solder Wire SN100C (030) provides sharp spreading and good separation.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2016-03-30 09:22:53.0
Ersa is pleased to announce that it will exhibit a wide range of industry leading technologies in Hall 7, Booth 117 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. Additionally, the company will exhibit the VERSAFLOW3/45 with VERSASCAN and VERSAEYE for the first time.
Industry News | 2013-08-13 20:22:03.0
The share of international exhibitors at productronica, which takes place in Munich from November 12 - 15, has increased again. For the first time ever, Estonia, Morocco, the Netherlands and the Czech Republic will have joint exhibition stands at the fair.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
