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Nihon Superior to Display Complete Range of SN100C Soldering Materials at SMTA International 2008

Industry News | 2008-08-07 15:26:07.0

Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009

Industry News | 2009-11-02 21:58:24.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit at Electronics For You Expo 2012 (EFYEXPO2012)

Industry News | 2012-01-24 15:15:34.0

Nihon Superior (Singapore) Pte. Ltd. will showcase a new, expanded range of SN100C products in booth B-74B at the upcoming Electronics For You Expo 2012 , scheduled to take place February 16-18, 2012 in Hall No. 11 B, at the Pragati Maidan in New Delhi, India.

Nihon Superior Co., Ltd.

Inventec introduces two new lead free solder paste formulas

Industry News | 2017-10-17 20:32:02.0

Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.

Inventec Performance Chemicals

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems

8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems

New Equipment | Reflow

8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems 8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems Introductions:  The mainly component is adopted international bran

Beijing Torch Co.,Ltd

8-zone Reduced-Length Lead-Free Convection Reflow Soldering System

8-zone Reduced-Length Lead-Free Convection Reflow Soldering System

New Equipment | Reflow

8-zone Reduced-Length Lead-Free Convection Reflow Soldering System Introductions:  The mainly component is adopted international brand one. Temperature can warm up quickly and keep stable, High effective can save Electronic It is adopted in jointi

Beijing Torch Co.,Ltd

SEZ, IMEC to Explore Next-generation Wafer Cleaning Technologies

Industry News | 2002-04-11 08:38:03.0

A Joint-development Initiative for Environmentally Friendly, "Economically Viable" Wafer Cleaning Technology

IMEC

Indium Corporation's Dr. Lee to Present at ECTC

Industry News | 2009-05-13 22:19:17.0

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, �Achieving High Reliability, Low Cost, Lead-Free SAC Solder Joints Via Mn or Ce Doping� at the 59th Electronic Components and Technology Conference (ECTC) held in San Diego, CA, May 26 - 29, 2009. He will also chair the professional development course, �Achieving High Reliability of Lead-Free Soldering � Materials Consideration� at the conference.

Indium Corporation

Rehm Thermal Systems drive energy efficiency to unlock cost-of-ownership advantage

Industry News | 2009-11-03 09:42:11.0

Rehm Thermal Systems has reduced the cost-of-ownership of the formation of reliable solder joints for customers around the world. Driven by a commitment to energy efficiency that characterises products such as the VisionXP reflow system, Rehm’s cost-of-ownership advantage is the direct result of low energy consumption values.

Rehm Thermal Systems Korea Limited


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