Technical Library | 2013-07-25 14:02:15.0
Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.
Industry Directory | Manufacturer
We are a manufacturer of Reed Switches, SMD Reed Sensors and other customized Magnetic sensing solutions, incorporated in 1971.
New Equipment | Soldering - Other
LED soft light strip soldering machine Product Description: LED strip welding,According to the characteristics of LED equipment 5 meters depth of humanization design,engaged in a variety of different solder jo
Industry News | 2009-04-13 16:28:45.0
ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2019-03-18 08:16:50.0
Metcal today announced plans to exhibit at productronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will demonstrate its new Robotic Soldering System, Connection Validation (CV) Soldering System with new hand-pieces, and HCT2-200-11 Hot Air Pencil in Hall E2, Booth #2508.
Technical Library | 2021-01-13 21:34:29.0
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...
Industry News | 2018-02-27 20:05:31.0
Metcal announces that it has been awarded a 2018 NPI Award in the category of Repair and Rework for its Connection Validation (CV) Robotic Soldering System. The award was presented to the company during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. The Connection Validation Robotic Soldering System is the newest example of Metcal’s industrial ingenuity.
Industry News | 2018-04-25 19:50:46.0
Metcal announces that it has been awarded a 2018 SMT China Vision Award in the category of Selective Solder for its Connection Validation (CV) Robotic Soldering System. The award was presented to the company during an April 24, 2018 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2019-01-05 16:56:23.0
Metcal today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will demonstrate its Connection Validation (CV) Robotic Soldering System, CV Soldering System with new hand-pieces, CV-500 Soldering System and VFX-1000H Volume Fume Extraction System in Booth #1314.
HONGKONG FUHUA INDUSTRIAL LIMITED's main business is SMT equipment�Bparts as well as provide development�Bproduction�Bsales�Band maintenance of assistant equipment, there are jointing technique department�Bmechanism department etc in my company,and
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