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Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Peel Back Tester

Peel Back Tester

Videos

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

U.S. Technology Exports Down 26 Percent Since 2000

Industry News | 2003-06-23 09:04:32.0

China Replaces Japan and Mexico as Largest Supplier of Electronics to the United States

SMTnet

SMT007-MIRTEC Intelligent Factory Automation Article-November 2020

Technical Library | 2020-12-02 20:36:54.0

Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.

MIRTEC Corp

Circuits West Invests in AOT

Industry News | 2003-03-28 08:46:12.0

The high scan speeds and fast setup times of the Excalibur system make it a good choice for this sector of the bare-board PCB manufacturing industry

SMTnet

Good Chemistry: UIC, RBP Form Sales, Tech Support Pact

Industry News | 2003-02-10 08:20:11.0

Leading Suppliers of Chemistries for Circuit Board Processing Have Entered a Selling and Services Deal

SMTnet

Camden Electronics Appoints New Distributor in Germany for Enclosure Products

Industry News | 2003-06-09 09:41:14.0

Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.

SMTnet

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

MIRTEC AWARDS THE MURRAY PERCIVAL GROUP ‘MANUFACTURERS’ REPRESENTATIVE ORGANIZATION OF THE YEAR 2013’

Industry News | 2014-04-15 09:05:08.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it has named The Murray Percival Company ‘MIRTEC Manufacturers’ Representative Organization of the Year 2013’.

MIRTEC Corp


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Voidless Reflow Soldering

High Throughput Reflow Oven
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World's Best Reflow Oven Customizable for Unique Applications


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