Electronics Forum | Tue Feb 07 16:45:32 EST 2006 | Mike
Can someone point out what sort of defects at the joint I can expect if solder is above liquidus for 3-4 minutes rather than the typical 1 - 1.5 minutes. Voids? Grainy joints? Poor wetting? Thanks
Electronics Forum | Thu Jul 28 05:41:22 EDT 2005 | K
Hi guys, Have any of you encountered harwin connector M80-647 in the past? Have you noticed any problems with the reliability of the component, solderability and 'reworkability' (thats a new word for sure)? Heres a PDF of the component; http://www.
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek
Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit
Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Tue Aug 07 19:32:40 EDT 2007 | davef
Zinc from the brass diffuses into the solder and reacts with tin causing dezincification. Dezincification is a specific type of de-alloying, or selective, leaching corrosion of brass fittings. This type of corrosion selectively removes zinc from th
Electronics Forum | Fri Jan 14 07:55:07 EST 2000 | Pat Pepper
Hi Wolfgang, Thanks for the response. We had a similar situation to yours with some white tin samples that sat around for about eight months. Samples soldered right after they arrived soldered better than the ones we soldered eight months down the
Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com
We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick
Electronics Forum | Thu Sep 23 14:58:50 EDT 2004 | C Lampron
EMS-Engineer, Lead free alloys have a very low wetting creep. You probably will not ever get the same type of weting with a LF as opposed to SN 63/37. The question is if it is acceptable. Lead free solder joints cannot be inspected to the same crite
