Electronics Forum | Tue Dec 10 10:26:56 EST 2002 | davef
Questions are: * What is the current plating on the connector that is over the "plating of the leads is Nickel (99.9% purity)"? * What are the temperatures and durations at those temperatures that you read on these connector leads? * What solder allo
Electronics Forum | Fri Jan 24 11:05:38 EST 2003 | johnw
I fyour just using Sn/Pb in your paste even using nitrogen will lave you with slightly grainy joints. The silver from your PCB will disolve into the Sn/Pb at 'uncontrolled' rate what I mean is depending on the temperature and time above liquidous the
Electronics Forum | Fri Jan 24 19:19:11 EST 2003 | MA/NY DDave
Hi Don't really know what "your grainy" means. It could be good, marginal, or bad. You need to get some photos or micrographs of what is normal and off-normal. Compared to Sn/Pb 63/37 on mostly Sn it should look visually different. Every time you c
Electronics Forum | Fri May 26 14:15:16 EDT 2006 | patrickbruneel
Its it possible to post a picture from right after reflow? To see what we start with and compare the difference after 5 years. The grainy structure is not as much a concern as the growth-like appearance on the boundary of the solder. What paste al
Electronics Forum | Fri Feb 20 09:41:11 EST 1998 | Chrys Shea
| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre
Electronics Forum | Thu Jun 03 09:40:20 EDT 1999 | Ryan Jennens
In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cannot
Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData
We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Tue Jan 11 10:01:30 EST 2000 | Wolfgang Busko
Hi Pat, we had white tin boards laying around for about 10 month with no extra protection than the plastic bag that they were shipped in. Never thought of using them for there was a relayout planned to fix some serious bugs. But that�s life, relayo
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
