Full Site - : green laser marking (Page 1 of 261)

Mirtec Co, LTD to Showcase Leading AOI Solutions at NEPCON China, Shanghai

Industry News | 2008-04-08 23:29:59.0

Seoul, Korea � April 2008 � MIRTEC Co, LTD, the leading global manufacturer of AOI and AXI inspection systems announces it will showcase their complete line of inspection solutions in booth 4F10 at the upcoming NEPCON China/EMT China 2008 exhibition and conference, scheduled to take place April 8-11, 2008 in Shanghai, PR China.

MIRTEC Corp

MIRTEC Corp. to Highlight the MV-7L In-Line AOI System at SMTA International 2008

Industry News | 2008-08-11 23:45:48.0

OXFORD, CT � August 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it will display the MV-7L In-Line AOI System in booth 424 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando. FL.

MIRTEC Corp

MIRTEC to Unveil Revolutionary Inspection Technologies for Perfect Solder Joints and 30% Productivity Boost at productronica

Industry News | 2023-11-13 12:28:17.0

MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.

MIRTEC Corp

MIRTEC Corp. Wins a 2008 NPI Award for its MV-7L In-Line AOI System

Industry News | 2008-04-07 22:15:22.0

OXFORD, CT � March 31, 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it has been awarded a 2008 NPI Award in the category of Test & Inspection, AOI for its MV-7L In-Line AOI System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

MIRTEC Corp

MIRTEC Receives 2008 Advanced Packaging Award for Their MV-7L In-Line AOI Machine

Industry News | 2008-07-19 15:38:37.0

OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

MIRTEC Corp

MIRTEC to Premier Its AOI Series at APEX 2008

Industry News | 2008-02-28 21:48:17.0

OXFORD, CT � February 2008 � MIRTEC a leading global supplier of AOI systems to the electronics manufacturing industry, announces that it will introduce its MV series of AOI systems in booth 1857 at the upcoming APEX exhibition & conference scheduled to take place April 1-3, 2008 in Las Vegas.

MIRTEC Corp

IPTE FlexMarker Laser Marking Machine

IPTE FlexMarker Laser Marking Machine

Used SMT Equipment | Labeling Systems

https://bajabid.hibid.com/lot/62286252/2018-ipte-flexmarker-laser-marking-machine/?q=&ref=catalog

Baja Bid

Agilent 5300 5DX Series

Agilent 5300 5DX Series

Used SMT Equipment | Visual Inspection

AGILENT, X Ray inspection machine, In line, type 5300-5DX-SERIES 3, SN: US40690565, double top opening, laser class 1, laser subsystem class 3B, equipped with double PC inside, monitor control AGILENT, included small table with standard monitor and k

Baja Bid

Online SMT Auction December 14 - 16, 2020

Industry News | 2020-12-08 10:03:33.0

Baja Bid will be selling used electronic manufacturing equipment in our upcoming SMT auction. The online bidding period opens on December 14th at 8:00am EST and begins closing on December 16th at 1:00pm EST.

Baja Bid

KE-2050/KE-2060 Causes and Countermeasures of Patch Failure

Technical Library | 2023-07-22 02:26:05.0

Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD


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