Industry News | 2022-04-20 14:41:47.0
From 3D SPI to 3D AOI and 3D Bond to 3D AXI and 3D MXI, Viscom AG will showcase a wide range of innovative solutions for intelligently networked quality control at the SMTconnect international trade fair for electronics manufacturing. A special highlight features new remote service offerings under the vConnect brand. At PCIM Europe, where power electronics are in the foreground, Viscom is particularly featuring 3D AXI.
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Technical Library | 2023-12-18 21:07:29.0
Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board. Nozzles can vary by size (internal diameter) and shape (making them suitable for different process types). This is all dictated by board design and process requirements. Selection of the nozzle type is dependent upon the product to be soldered and the desired cycle time. Examples of different nozzle types are shown here. Hand-load selective systems must be programmed with the parameters for multiple solder joints. However, many in-line systems are designed to be modular. This modularity allows for multiple solder stations with different conditions/nozzles to achieve low cycle times. Figure 1 shows the two distinct types of selective soldering systems offered by Pillarhouse International Ltd.
Technical Library | 2009-05-07 23:23:00.0
Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed.
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2019-01-30 20:37:50.0
Metcal today announced the global launch of the first Robotic Soldering System with patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers’ soldering process.
Industry News | 2010-03-03 14:29:02.0
OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it’s temperature-sensitive heater ensures low temperature soldering thus minimizing thermally induced stresses on cell surfaces.
Industry News | 2011-12-27 19:59:33.0
Fuji Machine Manufacturing Co., Ltd. with supplier Toyo Communication Technology Co., Limited will establish a joint venture called KUNSHAN FUJI MACHINE MFG. CO., LTD. (provisional) in Kunshan, Jiangsu, China. This joint venture will manufacture, in China, highly reliable, high quality, cost competitive machine parts and assemblies to be used in machines such as electronics assembly machines and machine tools. In addition, there is the prospect that electronics assembly machines and machine tools will be produced locally in the future. With both companies combining their strengths such as the advanced technology from Fuji and the supply chain from Toyo in this cooperative venture, we can provide more competitive products. This joint venture will be established in April 2012 (scheduled) and our target is to begin operations during 2013.
