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Parts & Supplies | Pick and Place/Feeders
Fuji placement machine NXT 44MM feeder MARK cover PM64621 PJ00143 FUJI NXT scrap with guide wheel ROLLER PJ00162 FUJI NXT scrap with gear (thick) PJ00172 FUJI NXT scrap with gear (thin) PJ02960 FUJI NXT 2 grid switch PJ03850 FIJI Fuji NXT Hardw
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Parts & Supplies | Pick and Place/Feeders
O-ring NXT II sealing ring PH00991 Model: FUJI Mounter Specification: NXTII sealing ring original brand new Part No.: PH00991 Name: NXTII sealing ring original brand new PH00991 FUJI NXTII sealing ring original brand new PH01681 FUJI NXT Plast
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Used SMT Equipment | Screen Printers
Speedline MPM Momentum Screen Printer Date of Manufacture: 6/2007 Details: Under Stencil Cleaner with Solvent GridLok® Windows XP Operating System Power: 200-240V ~ Single Phase ~ 50/60 Hz Condition: Co
Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | Screen Printers
Vintage: 12/2011 Details • Automated Paste Dispenser • GridLoc System • Laser Paste Bead Height Sensor • Contrast Based 2D Inspection (paste on pad)- • Triple Track Conveyor System (66" Track Length). With Servo Driven Vision X, Y
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
