Industry Directory | Manufacturer
Pioneer of numerous productivity enhancing tools designed to optimize SMT electronic equipment and processes. Innovator of the award-winning Grid-Lok, Magna-Print and Stinger technologies.
Industry Directory | Manufacturer
Asahitec offers high precision and high quality products guaranteeing only the best in photoengraving and imaging technologies. Asahitec offers world class products without compromising on quality and is respected by customers.
New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
New Equipment | Education/Training
IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c
Electronics Forum | Tue Feb 28 11:15:20 EST 2006 | billyd
In my last life we had pretty good luck with the Grid-lok system. Just not very good for extremely large boards, or very thin ones. (Tends to push thin ones up and bend them before the table rises. **On DEK printers, mind you) Form-flex was a nightma
Electronics Forum | Tue Feb 28 14:49:48 EST 2006 | vdizzle
Yep Grid-Lok sucks for thin boards. We have it set up in 4 Dek Horizon 01s. Grid-Lok is actually strong enough to snap really thin boards. Other than that, the system has been great, especially if you have to do 10-12 changeovers per line per shif
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
Software version: 09SP13P02 Details: • Green Camera • Under Stencil Wipe • Vacuum • Edge Clamping • Grid Lok® Ready
Industry News | 2010-12-01 14:28:16.0
With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Parts & Supplies | Screen Printers
Name: P1928; vacuum channel opening and closing cylinder Part Number: P1928 Description: P1928 vacuum pump channel opening and closing cylinder Applicable models: UP; AP Printing Presses P1928 vacuum pump channel opening and closing cylinder C
Parts & Supplies | Screen Printers
Name: P1928; vacuum channel opening and closing cylinder Part Number: P1928 Description: P1928 vacuum pump channel opening and closing cylinder Applicable models: UP; AP Printing Presses P1928 vacuum pump channel opening and closing cylinde
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2016-02-04 19:11:47.0
In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_custom-grid-size-and-layer-colour_topic1853.xml
PCB Libraries Forum : Custom GRID Size and Layer Colour PCB Libraries Forum : Custom GRID Size and Layer Colour This is an XML content feed of
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
