Industry Directory | Manufacturer
Pioneer of numerous productivity enhancing tools designed to optimize SMT electronic equipment and processes. Innovator of the award-winning Grid-Lok, Magna-Print and Stinger technologies.
Industry Directory | Manufacturer
Asahitec offers high precision and high quality products guaranteeing only the best in photoengraving and imaging technologies. Asahitec offers world class products without compromising on quality and is respected by customers.
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
Electronics Forum | Tue Feb 28 11:15:20 EST 2006 | billyd
In my last life we had pretty good luck with the Grid-lok system. Just not very good for extremely large boards, or very thin ones. (Tends to push thin ones up and bend them before the table rises. **On DEK printers, mind you) Form-flex was a nightma
Electronics Forum | Tue Feb 28 14:49:48 EST 2006 | vdizzle
Yep Grid-Lok sucks for thin boards. We have it set up in 4 Dek Horizon 01s. Grid-Lok is actually strong enough to snap really thin boards. Other than that, the system has been great, especially if you have to do 10-12 changeovers per line per shif
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Pick and Place/Feeders
Assembleon Topaz XII Pick & Place Model: Topaz II Vintage: 2004 Grid-Lok Max Board Size: 18" x 17.3" 20,000 CPH 0201 Capable 8 Head - Single Beam Complete & Operational Various Feeders Available
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2010-12-01 14:28:16.0
With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.
Parts & Supplies | Screen Printers
Name: P1928; vacuum channel opening and closing cylinder Part Number: P1928 Description: P1928 vacuum pump channel opening and closing cylinder Applicable models: UP; AP Printing Presses P1928 vacuum pump channel opening and closing cylinder C
Parts & Supplies | Screen Printers
Name: P1928; vacuum channel opening and closing cylinder Part Number: P1928 Description: P1928 vacuum pump channel opening and closing cylinder Applicable models: UP; AP Printing Presses P1928 vacuum pump channel opening and closing cylinde
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
| https://www.wesource.com/screen-printers/dek-18-grid-lok-modules-lot-of-3-id-000862-5/22/
DEK 18" Grid-Lok Modules (Lot of 3) ID_000862 (5/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_custom-grid-size-and-layer-colour_topic1853.xml
PCB Libraries Forum : Custom GRID Size and Layer Colour PCB Libraries Forum : Custom GRID Size and Layer Colour This is an XML content feed of
