Industry News | 2019-11-05 22:20:35.0
8 Layer PCB Stack-up Guidelines How to improve EMC performance on 8 layer PCB design? The following text is reproduced, with permission, from Part 4 of a 6-Part article on PCB Stackup by Henry W. Ott. The original article is available at http://www.hottconsultants.com/tips.html
New Equipment | Education/Training
If you are trying to instruct new electronic technicians, high schoolers, or DIYers in the skill of soldering and do not want to instruct them on home made PCBs that are not representative of the type parts or the types of surface finish you would ex
Industry News | 2014-08-05 17:29:07.0
Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
New Equipment | Fabrication Services
Multi-Layer flexible circuits consist of 3-6 copper layers encapsulated with dielectric, normally connected with a plated thru-hole (see diagram below). Multi-layer circuits can be fabricated with or without coverlayers. When to Use Multi-Layer Fle
Industry News | 2018-07-17 14:02:04.0
Connected, “smart” wearables such as rings, bracelets, clothing and shoes are benefitting from tiny RF chip antennas that take up less PCB space and allow for more miniaturized devices
Industry News | 2018-07-17 13:56:31.0
Tiny RF chip antennas are no longer relegated to PCB “keep out” area, allowing product designers to further miniaturize wireless biosensors and medical wearables
Industry News | 2003-03-07 08:04:13.0
Ansoft has upgraded its SIwave simulation software for the advanced modelling of leading-edge IC packages and PCBs, meeting a growing demand for fast and accurate signal- and power-integrity analysis.
New Equipment | Rework & Repair Services
Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA dev
New Equipment | Rework & Repair Equipment
New Dual Port Simultaneous Desoldering System designed for plated-through-hole component desoldering. The easy-to-grip handle allows the task to be completed quickly and comfortably. This "shop-air" hand tool, in combination with the new dual simulta
Industry News | 2009-06-08 23:35:30.0
Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming� CF3366�, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.
