New SMT Equipment: gsm and head and 3 (968)

Refurbished Yamaha YV100 ll Pick and Place Machine

Refurbished Yamaha YV100 ll Pick and Place Machine

New Equipment | Pick & Place

Refurbished Yamaha YV100 ll Pick and Place Machine Machine Type Automatic pick and place Brand Name Yamaha Machine Model YV100II Cycle Time Mix Comp. (Ideal) 0.198sec/chip CPH 12000 Ideal (

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Refurbished YG100R Chip Mounter SMT Pick and Place Machine

Refurbished YG100R Chip Mounter SMT Pick and Place Machine

New Equipment | Pick & Place

YAMAHA Refurbished YG100 Chip Mounter SMT Pick and Place Machine YAMAHA YG100 high-speed placement chip, high-precision, high-speed modular placement machine,high rigidity dual drive structure,High-performance servo system, high-resolution digital m

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Electronics Forum: gsm and head and 3 (55)

GSM2 and FlexJet heads

Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01

There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the

Universal GX-11S and Pneumatic Feeders?

Electronics Forum | Tue Apr 25 20:22:32 EDT 2023 | ttheis

We have a line running GSM1 machines and we are considering upgrading to GX-11S machines with FJ3 heads. Does anyone know if the GX-11S machines can take pneumatic feeders from the GSM machines? We have a very large inventory of the pneumatic and ele

Used SMT Equipment: gsm and head and 3 (44)

Juki  KE-2070L Pick and Place Machine Specification

Juki KE-2070L Pick and Place Machine Specification

Used SMT Equipment | SMT Equipment

JUKI KE-2070L Pick and Place Machine Specification Model :KE-2070L ■ Laser mount head * 1 (6 suction nozzle) ■ PCB Board Size: L (50*30-410*360mm)   ■ Component height: 6mm ■ Component mount range:                 Laser Recognition:  0402(0100

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Mydata My9e Pick and Place

Mydata My9e Pick and Place

Used SMT Equipment | Pick and Place/Feeders

Make:  Mydata Model: My9e Vintage: 2009 Software Version:   TPSys 2.9 Details: • T3 Table • Hydra Head • Midas Head • Linescan • Dual Vision (DVS) Condition:  Complete & Operational Location

Lewis & Clark

Industry News: gsm and head and 3 (116)

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

MIRTEC to Exhibit Award-Winning Line of 3D AOI and SPI Inspection Systems at SMTAI 2013

Industry News | 2013-09-13 17:01:33.0

MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems at SMTAI 2013 booth #722. This three-day event is scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

MIRTEC Corp

Parts & Supplies: gsm and head and 3 (194)

MPM  P1928 Vacuum channel opening and closing cylinder

MPM P1928 Vacuum channel opening and closing cylinder

Parts & Supplies | SMT Equipment

Vacuum channel opening and closing cylinder Name: P1928; vacuum channel opening and closing cylinder    Part Number: P1928    Description: P1928 vacuum pump channel opening and closing cylinder    Applicable models: UP; AP Printing Presses    P1

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha Y1 AXIS MOTOR FOR YG100B Pick and Place Machine

Yamaha Y1 AXIS MOTOR FOR YG100B Pick and Place Machine

Parts & Supplies | Assembly Accessories

YAMAHA Y1 AXIS 90K63-611404 MOTOR FOR YG100B Pick and Place Machine More Yamaha parts in stock KM9-M7107-00XSHFT, HEAD ASSYYV100II     KM9-M7106-00XSHAFT HEAD ASSY YV100II     KV8-M713S-A0X STD.SHAFT2,SPARE YV100X    KV8-M712S-A0X STD.SHAFT1,SP

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: gsm and head and 3 (2)

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Technical Library | 2013-01-24 19:16:35.0

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.

Christopher Associates Inc.

Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow, Opens, and Shorts with Dual Full-Field 3D Surface Warpage Data Sets/

Technical Library | 2014-08-19 16:04:28.0

SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.

Akrometrix

Videos: gsm and head and 3 (51)

Camalot NuJet and DDH (Dual Dynamic Head)

Camalot NuJet and DDH (Dual Dynamic Head)

Videos

NuJet and DDH

ITW EAE

Yamaha YRM20 Modular Pick and Place Machine

Yamaha YRM20 Modular Pick and Place Machine

Videos

Yamaha YRM20 Modular Pick and Place Machine ❙ Features of Yamaha YRM20 Fast and flexible Yamaha pick and place machine, Yamaha modular chip mounter, Yamaha SMT placement. Any item can be produced. 1. Fusion with Σ technology achiev

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: gsm and head and 3 (2)

Wisconsin Chapter Webinar: 3D Printing Technologies and How It Relates to Our Industry

Events Calendar | Tue May 30 00:00:00 EDT 2023 - Tue May 30 00:00:00 EDT 2023 | ,

Wisconsin Chapter Webinar: 3D Printing Technologies and How It Relates to Our Industry

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: gsm and head and 3 (1)

Failure Analysis and Debug (ICT) Technician

Career Center | Toronto, Ontario Canada | Engineering,Production,Quality Control

Work on ICT and functional test failures. Troubleshoot assemblies to the component level. Minimum one year of experience in Failure Analysis or In-Circuit Testing, or a recent graduate with a heavy course emphasis in this area. Understanding of

Adecco/Celestica

Express Newsletter: gsm and head and 3 (872)

Partner Websites: gsm and head and 3 (44622)

HEAD SINK AND ADHESIVE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0355-head-sink-and-adhesive

HEAD SINK AND ADHESIVE ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● D9650 ● D9650Z PRODUCTION ● FastLine P300 ● Facts2 DF2400

ASYMTEK Products | Nordson Electronics Solutions

UNIVERSAL GSM head encoder 50643903 | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/50643903-gsm-head-encoder-191879?page=526&order=name+asc

UNIVERSAL GSM head encoder 50643903 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products GSM head encoder Public Pricelist Public Pricelist GSM head

Qinyi Electronics Co.,Ltd


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PCB Handling with CE

High Throughput Reflow Oven
Conductive Adhesive & Non-Conductive Adhesive Dispensing

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Pillarhouse USA for handload Selective Soldering Needs

Easily dispense fine pitch components with ±25µm positioning accuracy.
thru hole soldering and selective soldering needs

Software for SMT placement & AOI - Free Download.
High Throughput Reflow Oven

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
PCB Depanelizers

Find a wide selection of nozzles, solder materials, storage solutions and more at SALESCON