Electronics Forum | Thu Jan 22 12:21:54 EST 1998 | Michael Allen
Is there a standard (JEDEC or other) for "lead sweep" errors on fine pitch (eg, 0.5mm) gull wing leads? Parts from one of my suppliers has a sweep error up to 6 mils; the mechanical drawing does not address lead sweep error, nor is there a true posi
Electronics Forum | Fri Dec 20 17:09:52 EST 2019 | slthomas
I agree, that is not a gullwing lead in the normal sense but that doesn't address the failure. The wetting looks fine unless there is a problem under the lead, which is hard to tell since there is an obvious fracture. That appears to be the edge o
Used SMT Equipment | Pick and Place/Feeders
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Used SMT Equipment | Pick and Place/Feeders
Hitachi Mounter SIGMA G5 Features: SIGMA G5 models can be mounted spotlights television sets, LED lamp shade, and is the only ultra-fast, turret structure mounted transparent lamp placement machine! Hitachi SIGMA G5 parameters Mounting head st
Industry News | 2008-08-11 23:45:48.0
OXFORD, CT � August 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it will display the MV-7L In-Line AOI System in booth 424 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando. FL.
Industry News | 2008-04-07 22:15:22.0
OXFORD, CT � March 31, 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it has been awarded a 2008 NPI Award in the category of Test & Inspection, AOI for its MV-7L In-Line AOI System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic626&OB=ASC.html
? If so, it was built using the IPC-7351 "Most" Environment. n IPC-7351 Density Level A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices
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. Operators will obtain the knowledge to: State the purpose, scope, schedule, and grading criteria of the re-certification course. State IPC policies that govern operation of 7711/7721 certification and re-certification program Demonstrate Through-Hole, J-lead, Gull-Wing, Fine Pitch, and Chip component rework and replacement