Industry News | 2017-04-13 06:06:32.0
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2015-04-07 15:51:51.0
Vi TECHNOLOGY will exhibit in Booth 7A-331 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2017-05-30 20:05:30.0
3D inspection technology leader Koh Young Technology marked 15 years of continuous success in providing Total 3D inspection solutions to SMT/PCB assembly and other manufacturing industries. Koh Young celebrated its 15th Foundation Day on May 1, 2017. Established in 2002, Koh Young has led the industry in providing the world’s most advanced 3D measurement quality assurance solutions, including its market-leading Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2013-06-07 14:47:43.0
CSM Electronics' Yestech AOI installation - case study
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Fri Jul 21 12:01:09 EDT 2006 | CKH
Hi Folk, what is the possible cause for the components (e.g ICs) to be Solder shorted? I know that one of the cause is the solder paste height is too thicked. Could anyone advise me on then possible root cause and solution(to minimize the rate of so
Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee
What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold
