Industry News | 2008-02-06 18:44:36.0
EAST WINDSOR, CT � February 6, 2008 � Blue Thunder Technologies Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it has numerous ESD products available.
Industry News | 2009-03-02 22:58:58.0
Business results reflect National Starch acquisition and Ecolab sale
Industry News | 2010-07-08 12:04:50.0
New method creates super-thin, high integrity, continuous metal lines that surpass today’s semiconductor industry requirements.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2012-12-07 14:16:26.0
Printed electronics has reached its tipping point as evidenced by the world's largest event on the topic, Printed Electronics USA, now taking place in Santa Clara California, staged by the leading analysts on the subject, IDTechEx.
Industry News | 2014-03-19 13:27:35.0
Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week.
Industry News | 2015-06-03 14:32:51.0
Based on the strong, continued progress in developing customized, integrated barrier films for display applications, The Electronics Group of Henkel announced today that it has made an additional investment in ultra-barrier film technology innovator, Vitriflex, Inc. Henkel made its first equity investment and signed a joint development agreement (JDA) with the promising start-up company in May 2014. In this latest round, Henkel was the lead Series C investor.
Industry News | 2016-03-03 08:45:28.0
Henkel Adhesive Technologies today announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.
Industry News | 2016-03-27 14:19:07.0
Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
Industry News | 2016-03-30 09:04:09.0
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.
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