Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Inspection templates enhance the visual inspection process by guiding the operator's eye to a specific location on the board to check for the presence and correctness of components. Stentech uses state-of-the-art laser machinery to produce accurate
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
Industry News | 2015-12-04 13:06:33.0
December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.
Industry News | 2007-04-23 20:27:21.0
March Plasma Systems has received a firm purchase order for a FlexTRAK-WR wafer processing system from a major semiconductor manufacturing company.
Industry News | 2007-11-08 19:31:27.0
Simple Green� Stencil and Misprint Cleaner is specifically designed to remove all SMT solder pastes including Resin, Water-Soluble, No-Clean, Lead and Lead-Free from stencils, screens, and misprints.
Industry News | 2019-11-05 22:26:14.0
The board stack-up is probably the most essential piece for ensuring a successful PCB design. Modern high-speed boards require controlled-impedance traces, and whether you are using a simulation tool, a simple calculator, or the back of a napkin, you need to understand your manufacturing process to correlate your impedance calculations. This ensures that your trace widths and dielectric heights match what will actually be manufactured, and eliminates last-minute design changes.
Electronics Forum | Wed Oct 12 13:44:10 EDT 2016 | dekhead
Yes, bottom-side fids are usually half-etched with epoxy fill. just the half-etch gives a pretty "dirty" looking fid.
Electronics Forum | Wed Oct 12 11:02:59 EDT 2016 | hken
I think stencil manufacturers back fill half etched fiducials with black epoxy or something. I know I've had some worn and that's what I've done for my vision systems to be happy again.
Electronics Forum | Thu Oct 20 12:33:39 EDT 2016 | cyber_wolf
We get our fids laser etched and never have fid read problems. They are black. (see attached) All of our printers are Momentums. Half etch and fill is old school. I used to take 2 part epoxy and mix black printer toner into it and squeegee the mi
