Industry News | 2016-03-21 14:50:20.0
The SMTA is excited to announce six new half-day workshops for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia. The workshops are scheduled for Tuesday, April 12.
New Equipment | Test Equipment
CascadeTEK's Colorado and Oregon Test Facilities Offer HALT and HASS Testing. (Highly Accelerated Life Test) (Highly Accelerated Stress Screen) testing methods are an excellent tool to quickly uncover latent weaknesses in a product. Cascade TEK’s
Career Center | , Illinois USA | Engineering
Telecom OEM west of Chicago seeks Reliability Engineer halt hass ess BS EE Recruiters: will split http://www.stepbeyond.com/myersandassociates.htm
Industry Directory | Consultant / Service Provider
We offer Reliability Test Services including HALT, HASS, MIL-STD 810, vibration, shock, and drop testing. We provide comprehensive reliability solutions from design through to manufacture.
Used SMT Equipment | Conveyors
The Model 3140 Bare Board Loader is designed for introducing unpopulated boards into a high volume, low mix environment. Its high capacity storage bin (20" stack) allows the unit to run unattended for long periods of time. The pneumatic lift design a
ERI "open" courses are typically three days and several meet each year in different locations and dates. Please visit http://www.equipment-reliability.com/open_courses.html for a current course list.
Used SMT Equipment | Conveyors
2012 ASYS TRM 02 SMT Edge Belt Pass / Inspect Conveyor, 110VAC L to R Board Flow. Additional Board Handling Equipment available from Assured Technical, please inquire. FOB: Origin MN USA Contact: AssuredTechnicalServiceLLC@Gmail.com From th
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Our products consist of the following: * Ovens * Conveyor ovens * Temp/Humd/thermal shock chambers * Thermal curing * HALT/HASS chambers * Meter Mix Dispensing machines * Sinterite furnaces * Infrared oven systems * PCB thickness measurement
