Our products consist of the following: * Ovens * Conveyor ovens * Temp/Humd/thermal shock chambers * Thermal curing * HALT/HASS chambers * Meter Mix Dispensing machines * Sinterite furnaces * Infrared oven systems * PCB thickness measurement
Mark Gallant of DownStream Technologies presents an overview of DFMStream features and functionality.
Industry Directory | Consultant / Service Provider
At CSZ, we test products for a variety of industries and applications such as automotive testing,electronics testing, mil-std testing, battery testing, package testing, solar panel testing and more.
Industry Directory | Consultant / Service Provider
CSZ Testing Services is your single source for product testing and process evaluation. Let us know what you need tested and we will get back to you very quickly with a solution for you.
Industry News | 2003-01-20 17:56:52.0
February 17-19, 2003
Industry News | 2003-02-19 15:27:49.0
March 18-20, 2003
REI can accommodate and/or customize the PCBA or system level testing requirements tomeet your needs – whether that be NPI, production, or repair depot services. Functional Testing Flying Probe HALT / HASS Testing Highly Accelerated testing Sys
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Used SMT Equipment | Circuit Board Assembly Products
1, Features: SM-2008 separates both small and large PCBs fast and economicaly. To optimize operation,the separation length can be programmed Safe operation The PCB is placed with its pre-scored groove onto the linear blade,when the foot swith is p
Used SMT Equipment | Circuit Board Assembly Products
1,Features SM-2008A separates both small and large PCBs fast and economicaly. To optimize operation,the separation length can be programmed. Safe operation The PCB is placed with its pre-scored groove onto the linear blade,when the foot swith is p
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