Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2015-12-09 11:51:49.0
Microtek is proud to announce the opening of its Corporate Headquarters at 10865 Rancho Bernardo Road, Suite 101, San Diego, CA.
Industry News | 2008-08-29 17:03:47.0
Carlsbad, CA � August 29th, 2008: Machine Vision Products today announced the appointment of Sunny Lim as their sales and marketing manager for Malaysia and South East Asia. The recruitment is part of Machine Vision Products on going plans to improve customer contact and raise market awareness of their industry leading micro-electronic, packaging AOI and SMT Inspection products.
THY Precision Micro Electronics Molding offer high quality electric injection molding services with international quality standards. THY Precision produce micro plastic components using μm unit. We are well accustomed to developing and molding com
Industry News | 2008-07-01 15:34:36.0
Committed to promoting electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2011-07-18 13:17:11.0
STI Electronics will feature its key engineering services at the upcoming Space and Missile Defense Conference and Exhibition, scheduled to take place August 15-18, 2011 at the Von Braun Center in Huntsville, AL.
Technical Library | 2024-04-22 20:16:01.0
The solid-state electronics industry faces relentless pressure to improve performance, increase functionality, decrease costs, and reduce design and development time. As a result, device feature sizes are now in the nanometer scale range and design life cycles have decreased to fewer than five years. Until recently, semiconductor device lifetimes could be measured in decades, which was essentially infinite with respect to their required service lives. It was, therefore, not critical to quantify the device lifetimes exactly, or even to understand them completely. For avionics, medical, military, and even telecommunications applications, it was reasonable to assume that all devices would have constant and relatively low failure rates throughout the life of the system; this assumption was built into the design, as well as reliability and safety analysis processes.
Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Industry News | 2018-09-26 14:06:56.0
StratEdge Corporation will display its high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS, and EDI CON USA. StratEdge's packages meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices and the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.
