Electronics Forum | Thu Jul 17 20:20:21 EDT 2014 | mac5
Hi June, The biggest issue with an OSP finish is as soon as the PCB sees a heat cycle (reflow or wave) the finish will begin to degrade. If you have a single sided SMT assembly with THT components installed downstream it works pretty good. But a dou
Electronics Forum | Thu Nov 17 20:23:55 EST 2005 | davef
We're with your customer. We believe inner layer separation is not linked to a heating excursion. What you are seeing is separation between the hole wall and the copper plating in the barrel of the hole on an unstressed PTH. Although, it's possibl
Electronics Forum | Thu Nov 17 15:40:23 EST 2005 | Hoss
We have a board that has been diagnosed with inner layer separation from the barrel wall. This board is .093 thick and 12 layers. Several layers, in some cases, have little or no thermal relief making soldering difficult. We have since switched t
Electronics Forum | Thu Dec 11 07:29:58 EST 2008 | jdumont
I have done a few studies on this issue here. As a result we have increased hole diameter on heavily ground planed pins to a min of .015" over the lead diameter as well as preheating the PCB when hand soldering. I have also had to order the upper pre
Electronics Forum | Mon Nov 27 17:33:25 EST 2000 | Dave F
Ramon: I guarantee you there is corrosion on the solderable surfaces of your board. The issues are: * Flux selected is capable of removing the corrosion at hand. * Processes for applying the flux and soldering the board are effective for the sele
Electronics Forum | Fri Jan 19 07:54:56 EST 2007 | realchunks
I believe you are describing a pin in paste process. Not sure where a stencil is involved. Depending on you machine/pump, you can do damage to it by running paste thru it. Paste is a metal and will wear out internal parts. Also, most pastes used
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef
General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo
Electronics Forum | Fri Jun 09 15:46:34 EDT 2006 | samir
I say: �Wave flux needs to be heated to certain activation temps which won't be repeatedly achieved with a manual soldering process. Plus, you won't burn off any residual activator as you would if the board were immersed in a solder bath.� Muse say
Electronics Forum | Mon Jan 28 19:58:58 EST 2002 | davef
Well, reflow certainly would increase your preheat, wouldn�t it? On the other hand, some PTH [and SMT] components cannot bear the heat of a reflow oven. Some boards will never see proper barrel fill, because of either: * Design of the board. * Sl
