Industry News | 2008-02-04 11:15:15.0
The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
Industry News | 2008-03-15 15:22:12.0
OSAKA, JAPAN � March 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 249 at the upcoming APEX exhibition and conference, scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2008-10-07 20:52:28.0
OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Electronics Forum | Wed Nov 28 02:43:00 EST 2007 | philip_yam
Hi all, For leadfree HASL finish, is there any specification or guidelines for contamination level, esp Cu% to refer? How can we ensure the HASL finish composition is reliable for assembly? Thanks..
Electronics Forum | Fri Jun 12 21:36:04 EDT 2020 | SMTA-Josh
Has anyone had an issue with changing from a HASL surface finish to a LF HASL finish if it is still being used in a leaded process? Also we are having issues with the planarity on the fiducials with the HASL finish. Are there any suggestions or ch
Electronics Forum | Tue Mar 15 10:44:42 EST 2005 | jdengler
-If the aperture volume is the same, there will be more solder on the HASL finish joint due to the solder already present on the pad. This difference is not usually enough to cause insufficiant solder volume but will "look different". Sometimes an
