Electronics Forum | Wed Oct 15 08:55:59 EDT 2003 | John
I'm looking at an application that would require 62/36/2 solder paste. We currently run 63/37. I'd like to change across the board to prevent a mix up, but I don't know what concerns/issues that might create. The PCB's we currently run are HASL fi
Electronics Forum | Wed Jan 14 12:38:59 EST 2004 | Chris Lampron
Good Day, I have had a similar situation with a QFP. It turns out that the PCB HASL finish was too thin causing oxidation on the copper. The problem was only evident on the QFP as this part had the smallest deposition of paste (and therefore, flux)
Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
Electronics Forum | Thu Oct 27 08:27:57 EDT 2005 | Adam
Hi We are trying to solder a a contact whose base material is stainless steel, this is then nickel striked with a gold plating of upto 3 microns. We are trying to hand solder this to a standard 1.6 FR4 PCB with a HASL finish. We are seeing problems
Electronics Forum | Thu Jul 10 10:25:05 EDT 2008 | gregoryyork
I guess the paste is Leaded hence the 220 Peak temp and the Sn100c is Eutectic at 227C so you need to be hotter to melt the HASL finish or you are relying on it alloying together with the paste which takes much longer. suggest running peak temp of 23
Electronics Forum | Thu Jan 15 10:33:05 EST 2009 | rrpowers
One thing you must be very careful with when using Bismuth is that there is no lead anywhere else within the process, either components or boards. Lead-terminated components or hot air solder leveled (HASL) finished boards used in combination with a
Electronics Forum | Wed Apr 08 11:33:51 EDT 2009 | 1036
2) STD FR4 material with HASL finish, 4 layer board. Reflowed under tin-lead temps with another 4 layer board same time(no delamination problem). 3) We uasualy do not pre-bake board unless board is too old. 4) We do not have the board on hand right
Electronics Forum | Sun Nov 06 03:09:44 EST 2016 | muzzy
Hello. Thank you for your answer. Yes, you are right. It would be best to badmark those boards. But we, as a small contract assembler, can't throw away a 1/5 of client boards just because of damaged fiducials. Using pads and other features as fiducia
Electronics Forum | Fri Jun 07 11:19:14 EDT 2019 | gregoryyork
If you have soldered with HASL finish then the worrying chemistry will be more like NON IONIC. They sit there and attract moisture like mad and any chlorides they hold ionize in the moisture attracted and cause electromigration or SIR issues. They ca
Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
