1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
New Equipment | Assembly Services
Material: FR-4 Layer: 2 Board thickness: 1.0 mm Copper: 1 oz Surface finish: LEAD FREE HASL Min through hole: 0.3 mm Min line width: 0.3 mm Min line space:0.3 mm Soldermask color: Green Silkscreen color: white RoHS certificate
New Equipment | Assembly Services
Material: FR-4 Layer: 2 Board thickness: 1.0 mm Copper: 1 oz Surface finish: LEAD FREE HASL Min through hole: 0.3 mm Min line width: 0.3 mm Min line space:0.3 mm Soldermask color: Green Silkscreen color: white RoHS certificate
New Equipment | Assembly Services
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: PCB RoHS Compliant • Number of Layers: 1-30 layer • Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium • Copper Thickness: 1/3oz ~ 6oz • Boar
New Equipment | Assembly Services
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: PCB RoHS Compliant • Number of Layers: 1-30 layer • Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium • Copper Thickness: 1/3oz ~ 6oz • Boar
New Equipment | Assembly Services
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: FPC RoHS Compliant • Number of Layers: Single-sided, Double-sided, Multi-layers and Flex-Rigid PCB • Base Material: Polyimide(Kapton), Polyester(PET), FR4 • Copp
New Equipment | Assembly Services
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: PCB RoHS Compliant • Number of Layers: 1-30 layer • Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium • Copper Thickness: 1/3oz ~ 6oz • Boar
Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa
At Present the company is concentrating to meet Quick turn around/prototype and a Pilot Order requirement of :- Double Sided Pth & Multilayer upto 12 layers Printed Circuit Bare Board Material FR � 4 ( Nema � Grade ) with board thickness as per cus
600V *RO4350B *RO4003C Dielectric material & Stack up requirement FR-4(no copper): 0.05-3.2mm for option Prepreg type: 7628H(7630), 7628(43%), 7628(41%), 2116HR, 2116, 2113, 1080 and 1060 for option Copper
