Industry Directory | Manufacturer
DriSteem provides reliable and efficient humidity control, evaporative cooling, and water treatment solutions for commercial and industrial applications.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Electronics Forum | Wed Jul 17 03:23:09 EDT 2013 | vishnudas123
Dear All, can please tell specifications of heat resistant glass plate which is used to flux application and process control of wave soldering. can you tell the suppliers of the same in India. BR, Gupta.
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane, Gen 5.2, OMS
Industry News | 2013-01-04 16:00:38.0
04 Jan 2013 Heller Industries will showcase the Mark5 Series - SMT Reflow Soldering Ovens February 19-21 in San Diego, CA USA at the IPC APEX EXPO.
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
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Parts & Supplies | Pick and Place/Feeders
ETX Board with heat sink (9498 396 03996) for AX machine more information pls email Jasmine@qy-smt.com Part Number Description Part Number Description 5322 218 10804 DETECTOR, VACUUM 5322 218 11514 EPD 5322 218 10805 DETECTOR, COMPRESSER
Parts & Supplies | Air / Vaccuum
Bathrive furnace temperature insulation box heat insulation box metal anti scald heat insulation box details Product Name: heat insulation box Product model: tb0002 External dimension: 250 * 150 * 90mm (L * w * h) Average working temperature:
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Career Center | Rochester, New York USA | Engineering
Our high tech client located in the Western NY State area offers you the following challenge. Complete mechanical design responsibility from specification to the manufacturing process. We seek a candidate that has the following experience: Design
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Ability to handle compliance issues NEBS, EMI/EMC UL and various customer requirements, required to handle first product builds, BOM's and ECO's. Duties/Functions: Taking requests for new products and coordinating new development
Career Center | , India | Production
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat
Career Center | Brookfield, ALL USA | Management,Production
Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T
SMTnet Express, May 15, 2014, Subscribers: 22742, Members: Companies: 13878, Users: 36194 Performance of Light Emitting Diode on Surface Machined Heat Sink S. Shanmugan, D. Mutharasu, O. Zeng Yin, Universiti Sains Malaysia In the point
Heller Industries Inc. | https://hellerindustries.com/parts/671226/
671226 - Heat Exchange Assy, New Style Heat Exchanger Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_strategic_products_accuheat_oven.html
Accu-Heat Oven Strategic Products Accuheat Oven Equipment Description Strategic Products Model Number: Accu-Heat II Serial Number
