Electronics Forum | Wed Oct 25 12:14:35 EDT 2006 | GS
Yes SWAG you are right, heat could be dangerous for the parts to be removed. Any way it is not so easy to remove epoxy adhesive (3609) once it is cured. By heating the adhesive (over his TG temperature)it gets softened and by using a mec
Electronics Forum | Tue Sep 12 21:13:26 EDT 2006 | slthomas
I assumed he intended to glue the nut to the part, turn the board upside down and run it through. Thing is, you might seriously have to crank up the heat to get it to reflow with that big sink on there.
Electronics Forum | Tue Oct 24 19:18:18 EDT 2006 | SWAG
Thanks, GS This is a SMT LCD device with a plastic housing; we need to save the part if we can. I'm afraid the localized heat will damage it so not sure if that will be safe.
Electronics Forum | Thu Oct 13 14:24:10 EDT 2011 | dphilbrick
You can use a paste that flows at 2 different temps. (first side flows hotter than second side) Glue, as stated in other answer and capton tape covering the BGA will defect enough heat usually as well.
Electronics Forum | Thu May 23 10:10:30 EDT 2019 | emeto
Would you consider to glue this part when running first side? The other way is to create a pallet that will provide a heat sink in this area(or may be cover this part with FR4).
Electronics Forum | Wed Sep 23 13:27:55 EDT 1998 | Dave F
All y'all, We use two methods to secure/stake jumper wires to boards: 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. 2 Loctite 382 Tak Pak We use Tak Pak "99&44/100ths" more often than the "magi
Electronics Forum | Tue Sep 15 09:04:57 EDT 1998 | Chrys
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Fri Sep 11 13:57:24 EDT 1998 | Justin Medernach
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Thu Sep 10 17:57:38 EDT 1998 | Earl Moon
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
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