Full Site - : heat sensitivity (Page 19 of 32)

Wave Profiling a Ceramic SMT Cap

Electronics Forum | Wed Jan 02 13:31:55 EST 2002 | PeteC

The rule-of-thumb is to follow the flux mfg.'s recommended profile to achieve their specified top side PCB temperature before making contact with the wave. Typical top side PCB temps are 100-120deg.C. Your wave contact time should be around 2 seconds

Component testing

Electronics Forum | Thu May 22 00:21:27 EDT 2003 | AlCapone

The alternative is by looking at all your components data specs (heat-range), especially pay more attentions to heat-sensitive comps, and fine-pitch comps, odd-form comps, draw a diagram on a separate sheet of paper shown that temperature VS those ca

Re: Desperately looking for help

Electronics Forum | Wed Dec 13 11:15:20 EST 2000 | Travis Slaughter

I�m not sure but it looks like the �mini-chip thingie� is a filter cap if so it should not stop the playstation from working, may not work like you like but should do something. Did you use any static protection? If not you may have fried one or all

Soldering FBGA Virtex-II XC2V6000-4FF1152C

Electronics Forum | Thu Jul 10 15:00:58 EDT 2003 | russ

Louis, For whatever it is worth, When I have $5000 parts I don't even mess around with a rework station. I would mask off any heat sensitive components (We use water soluble masking like that for wave soldering) and then process through the oven yo

Good Profiler for reflow ovens

Electronics Forum | Mon Aug 16 20:22:54 EDT 2004 | Grant

Hi, Thanks for the info! In the software can you add solder paste specs and heat sensitive components and see where the profile sits against these fast? Measurement is the easiest part I think, but what I thinks harder is good software to analyze th

Repeated reflows

Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron

Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme

Lead free components in 62/36/2 paste prob.

Electronics Forum | Tue Nov 29 12:16:29 EST 2005 | Inds

MKS, You do not need to reach a temp of 245C to form a joint and surely not for 0603s. Since you are using such a high temp your flux is getting dried out.. Also if you are going to reach a peak of 245C on a brd that has Sn/Pb compt and Pb-free.. yo

BGA Rework

Electronics Forum | Tue Apr 25 16:42:00 EDT 2006 | russ

Sometimes you gotta do what you gotta do! We have to perform this on occasion as well. We perform this when we cannot get a board to stay free of tacoing, oilcanning, sagging or warping. (we needed a bigger preheater dimension wise) We have one no

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics

Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen

Sample assembly notes

Electronics Forum | Fri May 27 14:22:47 EDT 2022 | proceng1

I am not exactly clear on what you are looking for. From my customers, assembly drawing notes are assembly specific. If there is hardware, they might include the stack-up. If we are conformal coating, they usually indicate keep-out areas. If an LED


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