Electronics Forum | Fri Aug 04 10:08:18 EDT 2000 | John Thorup
Zactly...what type and size of component. Pressure sensitive or heat seal cover tape? Manufacturer or service house taped? One or all manufacturers/distributors. Are the components in the right size tape? Reasonably recent production? Are they rea
Electronics Forum | Thu Aug 22 22:09:05 EDT 2002 | davef
Determine the number points (parts) on a pc board to be measured/connected in temperature profile according to the purpose of the profile. For instance: * A thread here on SMTnet recently discussed �copper plate� profiling. It is used primarily for
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
Electronics Forum | Sat Jun 23 21:04:44 EDT 2001 | Stefan
If you want to tinker a bit with old machines, you could buy an inexpensive ( under $ 10,000 ) used Pick&Place machine and reverse the polarity on the tape feeding motor. If you don't heat seal the cover tape, but use pressure sensitive cover tape,
Electronics Forum | Wed May 21 19:43:05 EDT 2003 | billschreiber
Hello Carl, Thank you for the feedback. You are absolutely right. I was remiss in not addressing the other questions. 2. 440-R SMT Detergent will clean RMA and No-clean solder pastes in 1 � 2 minutes using ultrasonics at ambient temperature and 5
Electronics Forum | Fri Mar 21 15:51:23 EDT 2008 | g2garyg2
Thought I would reply and try to assist. PROMATION, my company, also manufactures Diode Laser soldering systems but with this stated we also manufacturer iron tip systems, soft beam systems and hot air solutions. The reasons are simple. Diode Laser
Electronics Forum | Thu Nov 11 10:09:06 EST 2004 | D.B.Davis
Dear Colleagues, I am working with a new prototype product that is presenting some interesting problems. My Engineering Dept. has made some suggestions that I find a little odd. I am looking for some confirmation from fellow SMD personnel as to the
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Thu Jun 17 20:57:44 EDT 1999 | Earl Moon
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Fri Jul 06 12:07:07 EDT 2001 | nwyatt
I have been researching lead-free paste for a while now and I will share with you what I can. Firstly, SnAgCu seems to be the common industry choice. It really depends on your application - the cell phone/pda sector is primarly using different comb
