Full Site - : heat sensitivity (Page 23 of 35)

Repeated reflows

Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron

Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme

Lead free components in 62/36/2 paste prob.

Electronics Forum | Tue Nov 29 12:16:29 EST 2005 | Inds

MKS, You do not need to reach a temp of 245C to form a joint and surely not for 0603s. Since you are using such a high temp your flux is getting dried out.. Also if you are going to reach a peak of 245C on a brd that has Sn/Pb compt and Pb-free.. yo

BGA Rework

Electronics Forum | Tue Apr 25 16:42:00 EDT 2006 | russ

Sometimes you gotta do what you gotta do! We have to perform this on occasion as well. We perform this when we cannot get a board to stay free of tacoing, oilcanning, sagging or warping. (we needed a bigger preheater dimension wise) We have one no

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics

Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen

Sample assembly notes

Electronics Forum | Fri May 27 14:22:47 EDT 2022 | proceng1

I am not exactly clear on what you are looking for. From my customers, assembly drawing notes are assembly specific. If there is hardware, they might include the stack-up. If we are conformal coating, they usually indicate keep-out areas. If an LED

BGA Heat Sinks

Electronics Forum | Thu Jun 17 17:04:43 EDT 1999 | Doug Batten

Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembly

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 02:27:57 EST 2006 | pavel_murtishev

Good morning, (1) This depends on component type. In general it would be better to have fully populated board. Or at least you should mount components with different thermal mass. You should place TC�s at three points at least: component with high t

Calculating Reflow Slope

Electronics Forum | Wed Oct 06 09:23:51 EDT 2004 | mikecollier

The sampling rate on the KIC software can be changed by the user. The default setting is a sample rate of 60 seconds, so that, every 60 seconds the "old" measurement is subtracted from the "new" measurement to calculate the slope (i.e., start temp i

What kind of fire extinguisher

Electronics Forum | Tue Mar 24 09:04:33 EDT 2009 | sachu_70

External CO2 extinguishers certainly help. But requires the alertness of a trained personnel to use the same effectively during a fire. I have also come across a solution wherein the extinguisher is kept always connected to continuously deliver pres

Non RoHs Requirement

Electronics Forum | Tue Oct 07 16:19:34 EDT 2008 | mikesewell

If at all possible buy parts with 3% min. lead on the terminations. If this is not an option, "mitigate" whatever the finish is. Typically this means tinning with 63/37 all the exposed lead, not just the solder joint area. Several companies can d


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