Electronics Forum | Thu Jan 19 11:10:13 EST 2017 | rgduval
I'd start by checking the manufacturers documentation, and seeing if they have any application notes regarding reflow recommendations for the part. But, in general, make sure to bake the parts prior to assembly, they are notoriously moisture-sensiti
Electronics Forum | Tue Mar 05 07:42:03 EST 2019 | charliedci
We've noticed that bare PCB from fab house use bubble wrap vacuum sealed, however most of the time at the corners of stack of PCB bubble wrap is broken. Can't get our PCB house to change. For moisture sensitive components in house after partial use
Electronics Forum | Mon Jun 05 15:59:25 EDT 2023 | daniel_stanphill
Sorry I thought I had replied to this message. I will admit we took some things for granted in the past. More research has been done to determine how many heat cycles a component can have, if it can be submerged, etc. That said, if you don't have an
Electronics Forum | Thu Jun 22 11:09:11 EDT 2000 | C.K.
TYPE of Preheater makes a HUGE difference, as well. Infrared (IR) and convection, 2 of the most common types of preheaters, have very different heat transfer characteristics..... Convection heats your board more uniformly, so you'll see very small
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
Electronics Forum | Thu Oct 25 11:29:04 EDT 2007 | ck_the_flip
Forget all the bickering and semantics. EVERYONE IS RIGHT!! ...but then again, in soldering, there IS no right, wrong, or indifferent... just blame. :-) Soldering is, after all, the most difficult process with the most opportunities for defects.
Electronics Forum | Tue Nov 28 22:34:55 EST 2006 | davef
Almost all boards are hydroscopic. In this, the epoxy holding the board together absorbs moisture. Almost all components are hydroscopic. In this, the epoxy encapsulating the component together absorbs moisture. So, as you heat the board / compon
Electronics Forum | Mon Jul 17 13:37:35 EDT 2006 | carln
Here is something I copied from Circuitnet.com. This appears to answer your question and then some... http://www.circuitnet.com/experts/ Ask the Experts Jul 17, 2006 What type of cleaner method is preferred for lead-free stencils? What type of s
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
