Electronics Forum | Mon Jul 10 12:39:07 EDT 2000 | Chris C
Hi Christopher, To my knowledge, heat seal along will not provide you the desire condition. Currently, we're using vacuum sealer to reseal all MSD restock items. If you have variety of package and constantly need to reseal the MSD parts, I'd like to
Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc
There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik
Electronics Forum | Thu Sep 16 21:11:10 EDT 2004 | davef
Left to its own devices the plastic used to seal your parts will take-on moisture in the air. When you heat there parts the water in the part expands and can damage the part, if not properly demoisturized. The instustry standards for controlling su
Electronics Forum | Thu Aug 25 08:54:24 EDT 2005 | stepheniii
Could it be cold solder? Are there parts nearby that might be soaking up lots of heat, or maybe lots of internal grounding near that corner? Once I saw something similar except it was on two different assemblies. Each time it was on the side of the
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup
Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the
Electronics Forum | Mon Jun 05 16:49:11 EDT 2000 | Chris
Is anyone having trouble with PSA (pressure sensitive adhesive) cover tape used with embossed plastic tape? I am placing 0402 components out of embossed plastic tape with PSA cover tape. The feeders gum up, the take up reels are impossible to remov
Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman
In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi
Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
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