Electronics Forum | Mon Oct 15 08:15:41 EDT 2012 | scottp
Is the designer's concern that the parts will fall off when hanging upside down during reflow? We've been doing this for decades and our test if we think a part is marginal is to glue a 2nd (and sometimes 3rd) part to the back and send it through re
Electronics Forum | Sun Apr 25 02:58:58 EDT 1999 | Haim H.
| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c
Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon
| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |
Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F
Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens
Electronics Forum | Wed Jan 21 22:35:01 EST 1998 | Scott
| Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this c
Electronics Forum | Mon Apr 29 22:41:36 EDT 2002 | davef
Refer to J-STD-33 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface-Mount Devices. You can be downloaded it free from http://www.jedec.org Assuming you want to meet expectations when selling your components to
Electronics Forum | Thu Apr 24 13:35:51 EDT 2003 | fmonette
Hi Jason, Welcome back to SMTnet. I just wanted to clarify one important detail relative to dry packing Moisture Sensitive Devices. Contrary to popular belief, it not necessary to use vacuum when sealing Moisure Barrier Bags. A simple heat seal w
Electronics Forum | Thu Dec 15 17:30:42 EST 2005 | GS
Yes Davef, storage condition and long time remaining on shelf could effect pealing strength, but we experimented that by using Polystirene Carrier Tape also this problem was reduced almost to zero. Df, If I am not wrong when you talk about pr
Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22
Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo
Electronics Forum | Thu Oct 31 17:24:53 EDT 2019 | slthomas
Sorry I can't really answer any of your questions, but I'm curious about your idea. I've done vacuum drying of implantable medical components (made mostly of a proprietary bio-absorbable composition) but never electronic components. You're right to
