Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Mon Jul 26 05:02:33 EDT 1999 | Wolfgang Busko
| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh
Electronics Forum | Thu Jan 23 20:57:33 EST 2003 | davef
If the flux was not activated (ran in another area of the board), the flux should be removed from the board. Any Comments? A: We agree. In order for its �benigness� to take effect, NC flux is affected by: * Type of flux * Amount of flux * Proper ac
Electronics Forum | Sat Jul 22 03:27:36 EDT 2023 | shrikant_borkar
hi here are consolidated inputs to you you must validate before establishing your process. ESD-safe Material: Ensure that the masking tape is made of ESD-safe materials that have low triboelectric charge generation. Common materials used in ESD-sa
Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Wed Dec 22 20:51:12 EST 2004 | Mark
Yes, shameless. You could have come out and said that APE's equipment is the best thing since sliced bread but . . . you had to get all scientific with us. We already get bombarded by subliminal messages in commercials now, tech forums. In all ser
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
Electronics Forum | Mon Jul 10 21:01:06 EDT 2000 | Dave F
Edmund: Responding to your questions: 1 What is purpose of using DI water to wash a PCBA? Compared to tap water, DI water is less likely to leave: � Metal cations on sensitive components. � Salts of Ca, Mg, and other stuff on metals on the assemb
