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Introduction to the Principle, Types and Advantages of Gas Sensors

Industry News | 2021-12-10 20:25:59.0

The gas sensor is used to detect specific gases in a certain area and continuously measure the concentration of gases as well. In the areas of coal, petroleum, chemical, municipal, medical, transportation, family and other safety protection, gas sensors are often used to detect the concentration or presence of gases that are flammable, toxic, or their oxygen consumption. Gas sensors are often indispensable in safety systems thanks to the detection of gases around.

OKmarts Industrial Parts Mall

Guide of Siemens Pressure Transmitter: Features, Working Principle and Troubleshooting

Industry News | 2021-12-15 20:08:31.0

Siemens pressure transmitter is a kind of equipment which converts pressure into pneumatic signal or electric signal for control and remote transmission. It can convert the physical pressure parameters such as gas and liquid sensed by the load cell sensor into standard electrical signals (such as 4 ~ 20mADC), which can be supplied to the secondary instruments such as indicating alarm instrument, recorder and regulator for measurement, indication and process adjustment.

OKmarts Industrial Parts Mall

Latent heat induced deformation of PCB substrate: Measurement and simulation

Technical Library | 2022-12-05 16:28:06.0

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Czech Technical University in Prague

Green Lighting Shanghai Expo and Forum 2010 Enjoys Successful Debut

Industry News | 2010-05-20 14:22:33.0

Green Lighting Shanghai Expo and Forum 2010, run by Reed Exhibitions and the China Solid State Lighting Alliance (CSA), came to a successful close at the Shanghai Everbright Convention & Exhibition Center in April. The event drew the participation of lighting industry giants like Philips, Astri, Cyber Energy, Shanghai Sansi, BYD, Everfine, Mingxin, Zhongwei Photoelectricity. It was an exceptional showcase of the latest products and technology solutions. Altogether, the three-day event attracted a total of 4,665 visitors and buyers.

Reed Exhibitions

Thermaltronics’ Tips to Improve Soldering Tip Life and Reduce Cost

Industry News | 2018-10-09 18:31:30.0

Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

Thermaltronics USA, Inc.

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Technical Library | 2021-05-13 16:03:25.0

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed

University of Seoul

Antistat wins Raspberry Pi packaging contract with Farnell element14 and Sony UKTec

Industry News | 2013-01-15 09:48:23.0

ESD supply chain and packaging specialist Antistat has been selected by Farnell element14 and SonyUKTec to supply static shielding bags for the Raspberry Pi mini-computer, which is now manufactured at Sony's UK Technology Centre in Pencoed, Wales.

Ant Group

Data I/O to Showcase SentriX™Security Provisioning Technology and ConneXTM Smart Programming Software for Automotive Applications and Smart Factory Initiatives at productronica

Industry News | 2017-10-18 19:54:28.0

Data I/O Corporation will showcase the new SentriX™ Security Provisioning Technology and ConneXTM smart programming software at the international productronica trade show November 14th- 17th in Munich, Germany at Hall A2, Booth 205.

Data I/O Corporation

Possible reasons for simultaneous solder skip and short circuit of BGA

Technical Library | 2018-11-07 03:31:04.0

Generally speaking, there are not many cases of insufficient solder and solder short in BGA soldering, but it is not impossible. Here we discuss some elements may cause it

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Seika Machinery to Demo New Rework and Conformal Coating Systems at APEX

Industry News | 2015-01-22 11:58:02.0

Seika Machinery will debut the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. in Booth #3701 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The all-in-one advanced technology SMT rework station is compatible with all kinds of rework and SMT component types, including 01005s.

Seika Machinery, Inc.


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