Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
Table 5. Each test cell contains replicate fully populated test boards to provide an initial sample size of 32 192CABGA and 32 84CTBGA components. Additional samples were assembled for baseline quality and microstructural characterization. Table 5
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Table 5. Each test cell contains replicate fully populated test boards to provide an initial sample size of 32 192CABGA and 32 84CTBGA components. Additional samples were assembled for baseline quality and microstructural characterization. Table 5
