Full Site - : heatsink (Page 11 of 35)

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

Tactilus® Sensor System Ensures Optimal Heat Sink Efficiency

Industry News | 2010-09-21 09:46:59.0

Dynamic Advance Allows Engineers to Instantaneously Map and Measure Pressure Distribution between Heat Sinks and Components in Real Time

Sensor Products Inc.

AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156

Industry News | 2014-06-05 12:21:18.0

AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.

AI Technology, Inc. (AIT)

New Yorker Electronics now Supplying Advanced Aluminum Casting Alloys from Amfas International

Industry News | 2020-12-29 19:40:56.0

Amfas State-of-the-Art Casting Alloys for High Strength and High Thermal Conduction Designed for Electronics Applications

New Yorker Electronics

What is SMT and where to by SMT spare parts

Industry News | 2017-08-17 06:55:03.0

what is SMT and where to by SMT spare parts

SMTPLAZA CO.,LTD

TopLine® Awarded US Patent for CCGA Lead Free Solder Columns

Industry News | 2021-04-01 08:18:33.0

TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.

TopLine Dummy Components

PACE IR 3000 Infrared BGA/SMT Rework System

PACE IR 3000 Infrared BGA/SMT Rework System

New Equipment | Rework & Repair Equipment

Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in

PACE Worldwide

GE 	IC200CHS002  competitive price

GE IC200CHS002 competitive price

New Equipment | Industrial Automation

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Moore Automation

GE 	IC693PWR324 best price

GE IC693PWR324 best price

New Equipment | Industrial Automation

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Moore Automation

GE 	IC693ALG392 best discount

GE IC693ALG392 best discount

New Equipment | Industrial Automation

We have quickly delivery! ************************************************************************************ 1.Pick me:Tiffany Guan 2.E-mail me : plcsale@mooreplc.com 3.Skype : dddemi33 4.Whats@app : +86 18030235313 5.QQ :2851195473 ********

Moore Automation


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Easily dispense fine pitch components with ±25µm positioning accuracy.
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