Industry News | 2013-11-05 10:04:10.0
Marquardt GmbH of Rietheim-Weilheim (Germany)uses the Viscom S3088 SPI3D solder paste inspection system.
Industry News | 2012-07-24 08:11:29.0
Kyzen announces that Dr. Mike Bixenman will present at the upcoming technology symposium hosted by BEST, Inc. entitled, “Sharpening Your Tools-Area Array Technology,”
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Industry News | 2024-01-29 10:54:17.0
Koh Young Technology will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing demand for electronic components, which necessitates fast and efficient processing. These advancements in measurement technology and AI integration have paved A machine with a computer on it Description automatically generatedthe way for enhanced packaging applications in the semiconductor industry.
Industry Directory | Manufacturer
VisionMaster is the original longtime manufacturer of advanced yet affordable 3-D solder paste inspection (SPI) equipment. VisionMaster provides best-in-class 3D white light technology and repeatability at laser technology prices.
Used SMT Equipment | SPI / Solder Paste Inspection
SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon
Used SMT Equipment | SPI / Solder Paste Inspection
ASC VisionPro M500 3D Solder Paste Inspection System (2019) Brand: ASC InternationalModel: M500 3D Solder Paste Inspection SystemS/N: PSI-107Year: 2019Software: ASCan ULTRA Version 2.4.4.5O/S: Windows 10 Pro System SpecificationsMaximum Object Thickn
Used SMT Equipment | SPI / Solder Paste Inspection
ASC VisionPro M500 3D Solder Paste Inspection System (2019) Brand: ASC InternationalModel: M500 3D Solder Paste Inspection SystemS/N: PSI-107Year: 2019Software: ASCan ULTRA Version 2.4.4.5O/S: Windows 10 Pro System SpecificationsMaximum Object Thickn
Used SMT Equipment | SPI / Solder Paste Inspection
2022 LineMaster Fusion 3D: Demo Machine for sale! LineMaster Fusion 3D provides high speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a fe
Used SMT Equipment | SPI / Solder Paste Inspection
TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
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