Electronics Forum | Fri Feb 12 19:02:21 EST 1999 | Jon Medernach
|As the squeegee shears the paste at the face of the stencil the vehicle used to contain the solder spheres compresses and expands out the top of the opening after the squeegee passes. This is 1 or 2 mil at most. The peaks should not be considered
Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG
Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more
Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford
AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no
Electronics Forum | Fri Nov 23 14:47:35 EST 2001 | kgroen
Some comments on the previous post: Be careful when looking at the proportion of SMT defects that are solder defects - you may very well find that only a small few of them originate at the screen printing step. As for specification limits for pas
Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean
| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar
Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
Electronics Forum | Tue Jan 12 16:16:21 EST 1999 | Sanjay Bhatikar
For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? It appears to me that there are two options: A: to have a pn chart based upon the % of
Electronics Forum | Tue Jan 12 17:56:18 EST 1999 | Jason Hall
| For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | It appears to me that there are two options: | A: to have a pn chart based upon
Electronics Forum | Wed Mar 15 09:01:11 EST 2006 | Vick
The lead was inspected for coplanarity and it's within the specification it's designed for and doesn't show any variation in terms of height as compared to it's adjacent lead that has good wetting
Electronics Forum | Mon Aug 21 10:47:48 EDT 2006 | FredC
Hello Mika, I just checked a windmill and a test nozzle we have on the bench. The useful travel of the nozzle before the risk of the crosspin getting stuck in the loading gate is 1.5mm, if it gets stuck it is the nozzle is 1.7 up. If the cross pin is
