Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer
| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Tue Jan 12 19:07:07 EST 1999 | Earl Moon
| | For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | | | It appears to me that there are two options: | | A: to have a pn chart bas
Electronics Forum | Mon Oct 23 06:50:06 EDT 2017 | spoiltforchoice
For package shapes/names I would recommend using manufacturer names. This is much safer than coming up with descriptive names like QFN32_5x5 as there are multiple 5mm 32Pin QFN shapes even when pitch is the same, this makes it safer to use a name in
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Fri Mar 13 15:09:20 EDT 2015 | marcelorotofrance
Hello everybody Lately our machine has been working pretty well, but it can’t last too long. Now, during this week’s production cycle, it began to increase the component’s reject rate to alarming levels (obviously the operators reported me when the m
Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef
We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe
Electronics Forum | Fri Feb 02 13:04:34 EST 2007 | daxman
Hey, thanks for the reply. I decided to check the tops of the clutches at station 8, and there is .16mm of variation between the highest and lowest clutch. It's weird because they are all new. If the tops of the clutches have variation, I'm sure to
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
Electronics Forum | Mon Feb 05 12:57:35 EST 2007 | cyber_wolf
Take the nozzles out and let the indicator tip touch the metal face the nozzle pushes up into. This will tell you whether the variation is in the shaft or the nozzles. Also while your indicator is touching the holder, manually grab the shaft assy a
.gif)
