Full Site - : height variations (Page 9 of 12)

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

CP4 Placement/Pickup Height

Electronics Forum | Fri Feb 02 10:24:50 EST 2007 | FredC

Daxman, Have you eliminated nozzle variation? The difference between a new and used CP6 nozzle can be .15mm. On a CP4 I would think it could be more. On new Cp4 nozzles the difference in effective nozzle length should not be more than .04mm. You can

Help needed to solder poorly designed SMT LED's

Electronics Forum | Tue Sep 24 22:29:04 EDT 2002 | davef

First, I don't have a clear fix on the problem. Please drill-down to more detail. We appreciate that you probably don't know the parlance. Just describe what you have and then what you'd like to have. Second, most 0402 LED are fabricated just lik

Voids in solder fillet

Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire

Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform

Re: Press-Fit

Electronics Forum | Tue Nov 07 09:26:37 EST 2000 | Peter Barton

Adam, The most common cause for this problem is a variation in the plating thickness of the through holes, particularly if they are Sn/Pb solder levelled PCB's. Most pressfit connectors require a fairly tight control on the diameter of the holes to

Tooling Support

Electronics Forum | Thu Sep 20 13:28:23 EDT 2001 | ohanlon

Here is how the FormFlex system conforms to component variations. The FormFlex system utilizes an oil chamber that is common to ALL the pins once the system is set. Pushing down one pin will cause the displaced oil to be shared by all the others pins

Tombstone defect

Electronics Forum | Fri May 16 13:43:29 EDT 2003 | T.Vick

Yukim, Just another thought (way off the solder paste trail that you've been on so far)....Are the parts similar in thickness? The 4796 and 4797 HSP's have a closed loop function that compensates for variations in component thickness based on fe

Vision Master 150 problems

Electronics Forum | Mon Mar 20 03:47:16 EST 2006 | Adrian

Hi guys, Has anyone ever had experiance with a Vision Master 150 ?, we have 2 onsite and I am trying to get accurate BGA paste height measurements from this machine, but both the machines are giving me results with huge variations, like +/- 0.2 thou

BGA opens

Electronics Forum | Thu Nov 12 04:35:13 EST 2009 | sachu_70

You can certainly venture out to the nearest lab for in-depth analyses. But since you mention 2-3% defectives in a batch, there is much you can do in-house as well. Measure the height of your solder paste deposit (in zero print gap condition)across a

CP4 Placement/Pickup Height

Electronics Forum | Thu Feb 01 20:17:56 EST 2007 | daxman

I was doing a PM on our CP4-2 and decided to check the placement height of every nozzle. (we're seeing some skewed components and a lot of dropout under stn. 1) I put a dial guage under the nozzle tip at stn 7, turned placing sol on, and checked ev


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