Electronics Forum | Fri Sep 10 14:32:49 EDT 1999 | John Thorup
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
Electronics Forum | Fri Feb 02 10:24:50 EST 2007 | FredC
Daxman, Have you eliminated nozzle variation? The difference between a new and used CP6 nozzle can be .15mm. On a CP4 I would think it could be more. On new Cp4 nozzles the difference in effective nozzle length should not be more than .04mm. You can
Electronics Forum | Tue Sep 24 22:29:04 EDT 2002 | davef
First, I don't have a clear fix on the problem. Please drill-down to more detail. We appreciate that you probably don't know the parlance. Just describe what you have and then what you'd like to have. Second, most 0402 LED are fabricated just lik
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Tue Nov 07 09:26:37 EST 2000 | Peter Barton
Adam, The most common cause for this problem is a variation in the plating thickness of the through holes, particularly if they are Sn/Pb solder levelled PCB's. Most pressfit connectors require a fairly tight control on the diameter of the holes to
Electronics Forum | Thu Sep 20 13:28:23 EDT 2001 | ohanlon
Here is how the FormFlex system conforms to component variations. The FormFlex system utilizes an oil chamber that is common to ALL the pins once the system is set. Pushing down one pin will cause the displaced oil to be shared by all the others pins
Electronics Forum | Fri May 16 13:43:29 EDT 2003 | T.Vick
Yukim, Just another thought (way off the solder paste trail that you've been on so far)....Are the parts similar in thickness? The 4796 and 4797 HSP's have a closed loop function that compensates for variations in component thickness based on fe
Electronics Forum | Mon Mar 20 03:47:16 EST 2006 | Adrian
Hi guys, Has anyone ever had experiance with a Vision Master 150 ?, we have 2 onsite and I am trying to get accurate BGA paste height measurements from this machine, but both the machines are giving me results with huge variations, like +/- 0.2 thou
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