Electronics Forum | Thu Jan 20 14:28:49 EST 2000 | Scott S. Snider
I ran this test back in '92 or '93 when Alpha was first pushing to change from Brookfield to Malcolm readings. The correlation between Malcolm readings to solder paste height is good. I could always look at the viscosity reading and know at least a d
Electronics Forum | Fri Dec 17 16:25:05 EST 1999 | Brian W.
I used an off-line paste height measurement device to control my paste process. I did not inspect every board, just a random sample once an hour. I have used both manual and automatic devices. I like the automatic becuase: 1 - I have no "operat
Electronics Forum | Tue Jan 24 18:21:22 EST 2006 | fredc
I have some old Fuji windmills here and I checked the usefull travel. It is approxiamately 1.5mm, the nozzles are suposed to have .3mm "preload" wich will take away from the usable overtravel. The windmill I checked is a reject that from when we rebu
Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake
Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba
Electronics Forum | Thu Aug 13 13:35:38 EDT 1998 | Mike Cox
| I am looking for information on any Gage R&R studies for the CyberOptics LSM solder paste inspection system. If you are a current user of one of these systems, are you finding any problems with the repeatability due to operator variation? What is
Electronics Forum | Thu Apr 11 04:03:28 EDT 2002 | mwoodall
The Alpha metals Hi Check 500 is used to measure paste deposit thickness. The paste height is found from a micrometer reading determined by focussing a beam of light on a track adjacent to a paste deposit and then onto the solder paste. I've measure
Electronics Forum | Mon Jan 30 13:19:37 EST 2012 | deanm
Now knowing that its a Quad, I'm assuming it has QuadAlign which spins the part it just picked in a beam of light and a sensor measures the length, width and height of each part. If it falls outside of a defined range, it will throw it in the dump bi
Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc
5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht
Electronics Forum | Thu Mar 18 12:32:16 EST 2004 | steve_arneson
There are many low cost paste inspection systems on the market today. It really depends upon your overall needs for process improvement. The CyberOptics LSM series of inspection devices use a single laser stripe to calculate both Height, Area and V
Electronics Forum | Thu Jul 14 16:05:55 EDT 2005 | russ
Good answer slthomas! This has got to be the biggest misconception out there. To perform SPC on a wave process you must first perfrom DOE to determine the critical parameters and or control limits. For example you will need temp reading devices tha
