适用于大尺寸PCB板及双轨道生产的世界一流的SMT 回流焊炉 随着最新的技术突破，HELLER推出了全新的MARK 5回流焊系列，为客户提供了更为经济的方案。新型的加热和冷却技术能最大限度 地减少氮气和电力消耗，省氮省电高达40%。因此，MK5系列不仅性能卓越，更是业界最具经济价值的回流焊系列产品。 选择适合您制程需求的回流焊设备 1826MK5 回流焊炉 - 这些马力为高容量要求提供了稳定的性能，同时大大减少预防性保养的时间及空间占地。 1936MK5/2043MK5 回流焊炉 -
Heating system (Heller 1812EXL ) 1. All the heating zones are controlled by PLC through PID 2. Heating separately according to different zones is workable to reduce starting power. 3. Turbo air system can improve air flow and provide high rising t
Electronics Forum | Tue Feb 19 08:57:43 EST 2019 | prasanth
hello experts if you had anyone rts and rss profiles HELLER 1707 MK III series 7 zone machine pls forward me prasanth
Electronics Forum | Tue Feb 19 08:41:02 EST 2019 | prasanth
dear experts, i want your suggestion for getting a profile in Heller 1707 mk iii series re-flow machine ,its 7 zone machine recently we had a solder ability issues , so pls guide me ,how to set rts profile parameters
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
Used SMT Equipment | Soldering - Reflow
The 1800 reflow oven models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformi
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:16:43.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Nano-copper sintering in formic acid vapor.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Career Center | Rancho Cucamonga, California USA | Production
The successful candidate will have at least one year experience and knowledge in Pick and Place programming for machines such as Fuji, Samsung, Panasonic, or Tyco; stencil printing and solder past knowledge; wave solder and wave solder washing proce
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Process Technician in our Lighting Manufacturing facility in Racine, Wisconsin. Summary: This person will be a primary contributor to the startup of a new SMT production line for LED PCB Assembly. This
Career Center | hyd, andhra pradesh India | Engineering,Production,Research and Development,Technical Support
i have a experience in smt and i acan operate europlacer and mydata machines.
Career Center | Sullivan, Ohio USA | Engineering,Maintenance,Production,Quality Control,Technical Support
· Develop or upgrade preventative maintenance procedures for components, equipment, parts, or systems. · Quoting of jobs to be competitive with other companies. · Problem solving and communication with operators for quality assurance. Pro
Reflow Profiling: Time Above Liquidus Reflow Profiling: Time Above Liquidus Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often
| https://www.feedersupplier.com/aboutus.html
China GOLDLAND ELECTRONIC TECHNOLOGY CO., LIMITED company profile Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Heller 公司 | https://hellerindustries.com.cn/software
HELLER Industries-软件下载 » 用于PCB焊接的对流回流焊炉 » 软件下载 HELLER Industries-软件下载 请联系我们下载 HELLER软件产品 Heller 365 – Heller 365 是 SPC 和可追溯性软件包，提供 3 个级别： Level 1 – （可追溯性）包括所有产品运行的记录、烘箱参数、CpK Level 2 – （Profile监控）包括 1 级功能和每块板的profile监控。 Level 3 – （Profile监控）包括 1级功能以及使用放置在板级附近的附加传感器棒对每个电路板进行Profile监控。 Heller Interface和Heller支持赋能工业 4.0持 兼容的接口标准 IPC CFX Hermes SECS/GEM ASM iLNB Fuji Link
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
