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HELLER Convenes a Successful 2024 Sales Kickoff Meeting, Setting the Stage for a Strong Year Ahead

Industry News | 2024-02-26 16:22:08.0

HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.

Heller Industries Inc.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Industry News | 2015-11-12 22:03:28.0

Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Inc.

Heller Industries Proud Recipient of 2021 Service Excellence Award for Soldering Equipment

Industry News | 2021-04-14 10:42:33.0

The 2021 Service Excellence Award for Soldering Equipment was given to Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers.

Heller Industries Inc.

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Videos

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php

Heller Industries Inc.

HELLER INDUSTRIES Presents: Formic Acid Sintering

HELLER INDUSTRIES Presents: Formic Acid Sintering

Videos

Nano-copper sintering in formic acid vapor.

Heller Industries Inc.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Industry News | 2021-11-08 14:38:39.0

Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Inc.

Congressman Rodney Frelinghuysen Visits Heller Industries in New Jersey.

Industry News | 2014-09-06 19:18:17.0

Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.

Heller Industries Inc.


heller running time searches for Companies, Equipment, Machines, Suppliers & Information

Heller Industries Inc.
Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Manufacturer

4 Vreeland Rd.
Florham Park, NJ USA

Phone: 973-377-6800

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

High Precision Fluid Dispensers
PCB Handling Machine with CE

High Throughput Reflow Oven
PCB Handling with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.