포름산 증기에서의 무플럭스 포름산 리플로우 Heller는 포름산 증기를 위한 수평형 무플럭스 포름산 리플로우 오븐을 설계해 생산에 활용할 수 있도록 제작했습니다. 이 새로운 오븐은 세미(Semi) S2/S8 안전성 표준(유독가스 포함)에 적합하도록 설계되었습니다. 포름산은 무플럭스 솔더 리플로우에서 효과적인 환원제로 보여져 왔습니다 수평형 리플로우 오븐에서 웨이퍼 범핑 애플리케이션에 대한 훌륭한 결과로 증명되었습니다 무플럭스 리플로우
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Parts & Supplies | Pick and Place/Feeders
47561117 nozzle 603K dedicated to Flexjet 44332002 44332002 Pc Bd Ifdr Ctlr 2 Assy 4433580-1 44335801 Feeder Interface Board 44374702 EPC-5A Radisys EPC-5A 80486 CPU Board 45 VACUUM PUMP WASHER 45475008 45475008 Hard Drive Kit for Univers
Industry News | 2014-05-12 16:06:39.0
SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2023-07-22 03:47:52.0
Optimize LED Lens production with our cutting-edge LED Lens Production Line. Enhance efficiency and precision in manufacturing LED lenses with our state-of-the-art equipment. Explore our innovative solutions to meet your LED lens production needs and stay ahead in the dynamic lighting industry
Industry News | 2019-12-16 22:31:09.0
Vacuum reflow solder is refers to the vacuum eutectic oven, vacuum in vacuum environment for high quality welding products, in the welding process of zhongtong into reducing system (N2, formic acid, N2H2, H2), to protect the product and the solder is not oxidized, at the same time the product and solder oxide on the surface of the reaction, make weld surface quality improvement, reduced the rate of welding hollow.
Used SMT Equipment | Soldering - Reflow
3°C/sec – even on large boards. Oven Length 680cm Process Gas Options Air, Nitrogen, Formic Acid, forming gas Heated Zones Convection: 10 Top / 10 Bottom IR: 3 Top Heated Length (Convection/Total) 327 cm / 430 cm Cool Zones 3 Top (Bottom Option) Max
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Technical Library | 2023-01-17 17:16:43.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Model:FUJI IP – 3 5000 w/MTU-4R Date of manufacturing: June, 1995 Hours Run:: 30,884 Hours SPECIAL REMARKS:: With right side MTU installed, With Vision Monitor, Reject Part conveyor installed. Machine Software Version: V2.52 Machine Vision Sof
Industry News | 2021-01-17 17:48:13.0
Altus is pleased to announce new partnerships in 2021 with Heller Industries, the market leader in reflow oven technology and Asscon, innovators in vapour phase reflow technology, joining the supplier portfolio.
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
