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. If the cohesive force among metal powders in solder paste is smaller than the force created by the gasification, a small amount of solder paste will leave the soldering pad and some of them may hide under the chip components. When reflow soldering
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-expert-2022-01-released_topic3041_post12132.html
> Silkscreen Line Width: The Silkscreen Line Widths were not applying the assigned Density Level line width Options > Components > BGA If the “Add Fiducials if Pin Pitch
